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Researchers at the University of California in Los Angeles have developed a new method for producing 3D printed electronics, which is nearly five times quicker than conventional techniques. The method involves two steps: (a) 3D printed shapes are lined with electrostatic charges, (b) the shapes are then dipped repeatedly into a resin mixed with electronically conductive materials. The resin is attracted to the printed shapes and each dip allows the creation of an additional layer on the shape until a 3D structure is formed. This faster method could expand the applications of 3D printing in consumer electronics such as soft robotics, antennas, and advanced prosthetics.
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